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108 Materialfysik jobs

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SØGERESULTAT (108 JOBS)
Sponsoreret
Technical University of Denmark (DTU)
Technical University of Denmark (DTU)
Beliggenhed: Lyngby, Danmark | Ansøgningsfrist: apr. 01
Postdoc within van der Waals Heterostructure-based Membrane Separation Technologies
DTU wish to employ a post-doctoral researcher for 24 months to carry out research in the potential of nanoporous van der Waals heterostructures based on 2D materials layers for the separation of fluid mixtures, in a project funded by the innovative Villum Foundation...
18 timer siden | Ansøgningsfrist: jun. 30
SOLEIL Synchrotron
SOLEIL Synchrotron
Beliggenhed: Saint-Aubin, Frankrig | Ansøgningsfrist: jun. 30
Post Doctoral position : DEIMOS beamline
SOLEIL is the French national synchrotron facility, located on the Saclay Plateau near Paris. It is a multi-disciplinary instrument and a research laboratory, whose mission is to run research programs using synchrotron radiation, to develop state-of-the-art instrumentation on...
21 timer siden | Ansøgningsfrist: mar. 28
Tampere University
Tampere University
Beliggenhed: Tampere, Finland | Ansøgningsfrist: mar. 28
Doctoral Researcher (chemistry), 1-2 positions
Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edges in technology, health and society. Read...
1 dag siden | Ansøgningsfrist: jun. 15
Max-Planck-Gesellschaft (MPG) & National Science Centre Poland (NCN)
Max-Planck-Gesellschaft (MPG) & National Science Centre Poland (NCN)
Beliggenhed: Polen | Ansøgningsfrist: jun. 15
Call for Dioscuri Centres of Scientific Excellence in Poland
Max-Planck-Gesellschaft (MPG) and National Science Centre Poland (NCN) open the fourth call for Dioscuri Centres of Scientific Excellence in Poland. The joint call by MPG and NCN is designed to establish up to three Centres of Scientific Excellence at Polish Host...
1 dag siden
AMOLF
AMOLF
Beliggenhed: Amsterdam, Holland
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...
2 dage siden
imec
imec
Beliggenhed: Heverlee, Belgien
R&D Engineer Grinding
Supporting R&D activities on Wafer Grinding and CMP Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...
2 dage siden
imec
imec
Beliggenhed: Heverlee, Belgien
R&D Engineer Layer Transfer
You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices). What you will do Miniaturization of system...
2 dage siden
imec
imec
Beliggenhed: Heverlee, Belgien
R&D Engineer Die to Wafer bonding
You will be responsible for developing new die bonding processes and will particicpate in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices). What you will do Miniaturization of system size is a...
2 dage siden
imec
imec
Beliggenhed: Heverlee, Belgien
R&D engineer Wafer to Wafer bonding
You will be responsible for developing new wafer bonding processes and participate in research activities where wafer to wafer bonding is required (3D logic, 3D integrated systems, image sensors, biomedical devices). What you will do Miniaturization of system size is a...
2 dage siden
imec
imec
Beliggenhed: Heverlee, Belgien
R&D Engineer Temporary Wafer Bonding & Debonding
You will be responsible for developing new temporary wafer bonding and debonding processes and you participate in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices). What you will...