Thermomechanical R&D Engineer – Automotive applications

Develop thermal and thermomechanical modeling studies to assess the manufacturability and performance of electronic packages

What you will do

The design of chips in the semiconductor industry is changing, shifting from monolithic processors to multi-tile or chiplet packages. This type of fragmented architecture promises higher flexibility and a faster time to market while remaining cost-effective. This technology is crucial for the automotive sector, as semiconductors are enabling a significant shift that includes self-driving cars and integrated artificial intelligence. One of the major challenges of this technology in the automotive industry concerns Quality and Reliability. Thermal management and thermo-mechanical integrity are among the most important factors contributing to reliable systems, as the damage mechanisms are generally activated by residual stress, whether thermal or intrinsic. Understanding the origin of these stresses and their effects is necessary to provide design guidelines for implementing fail-safe designs.

We are looking for a highly skilled and motivated Thermomechanical R&D Engineer to join our dynamic team. The ideal candidate will have experience in developing thermomechanical models for advanced packaging, which meets the requirements of the semiconductor industry’s new era of chip design.

In this role you will:

• Develop thermal and thermomechanical modeling studies to assess the manufacturability and performance of electronic packages, considering the unique challenges posed by the automotive environment.
• Evaluate and select materials suitable for automotive-grade chiplet packages, considering thermal conductivity, mechanical strength, and reliability.
• Collaborate with reliability engineers to enhance the overall robustness of chiplet packages.
• Develop and maintain thermo-mechanical design documentation.
• Work collaboratively with design, electrical, and software engineering teams to integrate thermomechanical considerations into the overall chiplet package design.
• Communicate the results to internal stakeholders, to imec’s industrial partners and to the scientific community.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. 

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. 

Who you are

• You have MSc or PhD degree in Mechanical Engineering, Physics or Mathematics, preferably PhD.
• Proficiency in using simulation tools for thermal and thermomechanical analysis.
• Proven experience in thermomechanical analysis, preferably in semiconductor or automotive R&D.
• You are a team player with experience working in an interdisciplinary team.
• You are fluent in English and have good communication skills to interact with various research groups in project partners.
• You are flexible in this challenging environment where priorities can switch easily.
• You like to try new approaches and you have a critical mindset.