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YOUR FUTURE RESPONSIBILITIESCoordination of infrastructure ramp up for FOWLP line at Silicon Austria labsDevelopment and optimization of FOWLP processes for both chip-first and chip-last approaches, including die placement, wafer-level molding, pr...
YOUR FUTURE RESPONSIBILITIES Lead efforts in applied research on magnetic thin films and spintronic applications aiming for novel device innovations and industrial process developments with 200-300 mm pilot line capabilities Actively form the R&D ...
Publication Date 20.03.2024Application deadline 31.05.2024Job Category Professorship PathJob Profile ProfessorshipEmployment Start December 2024Employment Type PermanentFields of Expertise (FoE) – Sustainable SystemsApplicants should be excellentl...